HDMP-3268 Datasheet, PDF (12/18 Pages) Agilent(Hewlett-Packard) – 3.2 Gbit/sec 68x68 Crosspoint Switch

Table 9. HDMP-3268 Thermal Characteristics^[5]
TA = 25^°C , VCC = VDD = VCC_DOUT = 2.5 V
Symbol
Parameter
ΨJT[2]
ΨJB[3]
θJC[4]
θ_JA[1]
Thermal characterization parameter: Junction to case.
Thermal characterization parameter: Junction to board.
Thermal resistance: Junction to case
Thermal resistance: Junction to ambient.
Units
Typ.
O_C/W
0.70
O_C/W
4.90
O_C/W
0.65
O_C/W
11.1
Note: Based on independent package testing done by Agilent.
Refer to HDMP-3268 thermal management application note.
1. θJA is based on thermal measurement in still air environment at 25°C on a standard 5 x 5” FR4 PCB as specified in EIA/JESD 51-9.
2. ΨJT is used to determine the actual junction temperature in a given application, using the following equation:
TJ = ΨJT x PD + TT , where TT is the measured temperature on top center of the package and PD is the power being dissipated.
3. ΨJB is used to determine the actual junction temperature in a given application, using the following equation:
TJ = ΨJB x PD + TB, where TB is the measured board temperature along centerline at edge of the package and PD is the power being dissipated.
4. θJC data is relevant for packages used with external heat sink.
5. Physical tests were carried out using 13.5 W as the power dissipation of the device.
Table 10. HDMP-3268 I/O Type Definitions
I/O Type
Definition
HS_OUT
Differential high speed output, LV PECL compatible
HS_IN
Differential high speed input, LV PECL compatible
S
Power supply or ground
CTL_IN
Control logic input, LVTTL and SSTL_2 compatible
CTL_I/O
Control logic input/output, LVTTL and SSTL_2 compatible
REFO
Reference output voltage for LVTTL and SSTL_2 I/Os
REFI
Reference input voltage for LVTTL and SSTL_2 I/Os
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