MB85R1002_07 Datasheet, PDF (14/15 Pages) Fujitsu Component Limited. – Memory FRAM CMOS 1 M Bit (64 K × 16)

MB85R1002
(Continued)
48-pin plastic FBGA
(BGA-48P-M23)
Lead pitch
Package width ×
package length
Lead shape
Sealing method
Mounting height
Weight
0.75 mm
8.10 mm × 6.10 mm
Ball
Plastic mold
1.10 mm Max
0.08 g
48-pin plastic FBGA
(BGA-48P-M23)
8.10±0.20(.319±.008)
(INDEX AREA)
0.95
+0.15
–0.10
.043
+.006
–.004
(Mounting height)
0.25±0.10(.010±.004)
(Stand off)
5.25(.207)
0.75(.030)TYP
B
6.10±0.20
(.240±.008)
S
6
A
5
3.75
4
(.148)
3
2
1
H G F E DC B A
48-ø0.35±0.05
(48-ø.014±.002)
ø0.08(.003) M S A B
0.10(.004)
C _{2007 FUJITSU LIMITED B48023S-c-1-1}
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/fj/DATASHEET/ef-ovpklv.html
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
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