XPC8260ZUHFBC Datasheet, PDF (6/41 Pages) Freescale Semiconductor, Inc – PowerQUICC II Integrated Communications Processor Hardware Specifications

Electrical and Thermal Characteristics
Table 2 lists recommended operational voltage conditions.
Table 2. Recommended Operating Conditions¹
Rating
Symbol
2.5-V Device²
Unit
Core supply voltage
VDD
2.4–2.7
V
PLL supply voltage
VCCSYN
2.4–2.7
V
I/O supply voltage
VDDH
3.135 – 3.465
V
Input voltage
VIN
GND (-0.3) – 3.465
V
Junction temperature (maximum)
T_j
105
°C
1 _{Caution: These are the recommended and tested operating conditions. Proper device operating outside of these}
conditions is not guaranteed.
2 _{Parts labeled with an “-HVA” suffix are 2.6-V devices.}
NOTE: Core, PLL, and I/O Supply Voltages
VDDH, VCCSYN, and VDD must track each other and both must vary in
the same direction—in the positive direction (+5% and +0.1 Vdc) or in the
negative direction (–5% and –0.1 Vdc).
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (either GND or V_CC).
Figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the
MPC8280. Note that in PCI mode the I/O interface is different.
4V
GV_DD + 5%
V_IH
GV_DD
GND
V_IL ^{GND – 0.3 V}
GND – 1.0 V
Not to exceed 10%
of t_{SDRAM_CLK}
Figure 2. Overshoot/Undershoot Voltage
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
6
Freescale Semiconductor