XPC8260ZUHFBC Datasheet, PDF (38/41 Pages) Freescale Semiconductor, Inc – PowerQUICC II Integrated Communications Processor Hardware Specifications

Package Description
5.2 Mechanical Dimensions
Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA
package.
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter, parallel
to primary data A.
Dim
A
A1
A2
A3
b
D
D1
e
E
E1
Millimeters
Min Max
1.45 1.65
0.60 0.70
0.85 0.95
0.25 —
0.65 0.85
37.50 BSC
35.56 REF
1.27 BSC
37.50 BSC
35.56 REF
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
38
Freescale Semiconductor