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XPC8260ZUHFBC Datasheet, PDF (5/41 Pages) Freescale Semiconductor, Inc – PowerQUICC II Integrated Communications Processor Hardware Specifications
Electrical and Thermal Characteristics
— Up to eight TDM interfaces (4 on the MPC8255)
– Supports two groups of four TDM channels for a total of eight TDMs
– 2,048 bytes of SI RAM
– Bit or byte resolution
– Independent transmit and receive routing, frame synchronization
– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN
primary rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and
user-defined TDM serial interfaces
— Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs,
SCCs, SMCs, and serial channels
— Four independent 16-bit timers that can be interconnected as two 32-bit timers
2 Electrical and Thermal Characteristics
This section provides AC and DC electrical specifications and thermal characteristics for the MPC8260.
2.1 DC Electrical Characteristics
This section describes the DC electrical characteristics for the MPC8260. Table 1 shows the maximum
electrical ratings.
Table 1. Absolute Maximum Ratings1
Rating
Symbol
Value
Unit
Core supply voltage2
PLL supply voltage2
I/O supply voltage3
Input voltage4
VDD
-0.3 – 2.75
V
VCCSYN
-0.3 – 2.75
V
VDDH
-0.3 – 4.0
V
VIN
GND(-0.3) – 3.6
V
Junction temperature
Storage temperature range
Note:
Tj
120
°C
TSTG
(-55) – (+150)
°C
1 Absolute maximum ratings are stress ratings only; functional operation (see Table 2) at the maximums is not
guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage.
2 Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V at any time, including during power-on reset.
3 Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH should
not exceed VDD/VCCSYN by more than 2.0 V during normal operation.
4 Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset.
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
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