XPC8260ZUHFBC Datasheet, PDF (25/41 Pages) Freescale Semiconductor, Inc – PowerQUICC II Integrated Communications Processor Hardware Specifications

Pinout
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
Copper Heat Spreader
(Oxidized for Insulation)
Polymide Tape
View
Die
Attach
Pressure Sensitive
Etched
Adhesive
Cavity
Soldermask
Die
Glob-Top Filled Area
1.27 mm Pitch
Glob-Top Dam
Copper Traces
Wire Bonds
Figure 14. Side View of the TBGA Package
Table 14 shows the pinout list of the MPC8260. Table 15 defines conventions and acronyms used in
Table 14.
Table 14. Pinout List
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
Pin Name
Ball
W5
F4
E2
E3
G1
H5
H2
H1
J5
J4
J3
J2
J1
K4
K3
K2
K1
L5
L4
L3
L2
L1
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
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