MCF5272VF66J Datasheet, PDF (486/544 Pages) Freescale Semiconductor, Inc – MCF5272 ColdFire® Integrated Microprocessor

Electrical Characteristics
23.1.2 Operating Temperature
Table 23-2 lists operating temperatures.
Table 23-2. Operating Temperature
Characteristic
Symbol
Value
Unit
Standard Extended
Maximum operating junction temperature
Maximum operating ambient temperature
T_J
T_Amax
100
115
°C
70¹
85¹
°C
Minimum operating ambient temperature
T_Amin
0
-40
°C
1 _{Use this maximum operating ambient temperature only as a system design guideline. All device operating parameters are}
guaranteed only when the junction temperature lies within the specified range.
23.1.3 Resistance
Table 23-3 lists thermal resistance values.
Table 23-3. Thermal Resistance
Characteristic
Symbol
Value
Unit
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
θ_JA
θ_JMA
θ_JMA
θ_JMA
θ_JB
θ_JC
Ψ_jt
51^1,2
26^1,3
41^1,3
23^1,3
15⁴
10⁵
2^1,6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1 _{θJA and Ψjt parameters are simulated in accordance with EIA/JESD Standard 51-2 for natural convection. Freescale}
recommends the use of θ_JA and power dissipation specifications in the system design to prevent device junction temperatures
from exceeding the rated specification. System designers should be aware that device junction temperatures can be
significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature specification
can be verified by physical measurement in the customer’s system using the Ψ_jt parameter, the device power dissipation, and
the method described in EIA/JESD Standard 51-2.
2 _{Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.}
3 _{Per JEDEC JESD51-6 with the board horizontal.}
4 _{Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on}
the top surface of the board near the package.
5 _{Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method}
1012.1).
6 _{Thermal characterization parameter indicating the temperature difference between package top and the junction temperature}
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
23-2
MCF5272 ColdFire^® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor