MC908AP8CFBE Datasheet, PDF (318/324 Pages) Freescale Semiconductor, Inc – Microcontrollers

Mechanical Specifications
23.2 48-Pin Low-Profile Quad Flat Pack (LQFP)
4X
0.200 AB T–U Z
9
A
A1
48
37
DETAIL Y
P
1
T
B
B1
12
36
U
V
AE
V1
25
13
S1
24
Z
S
4X
0.200 AC T–U Z
DETAIL Y
AB
G
0.080 AC
AD
AC
BASE METAL
M°
TOP & BOTTOM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
AE
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
T, U, Z
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
L
1°
5°
M
12° REF
N 0.090 0.160
P
0.250 BSC
R 0.150 0.250
S
9.000 BSC
S1 4.500 BSC
V
9.000 BSC
V1 4.500 BSC
W 0.200 REF
AA 1.000 REF
R
NJ
CE
F
D
0.080 M AC T–U Z
SECTION AE–AE
H
W
DETAIL AD
L°
K
AA
Figure 23-1. 48-Pin LQFP (Case #932)
MC68HC908AP Family Data Sheet, Rev. 4
316
Freescale Semiconductor