K20P121M100SF2 Datasheet, PDF (3/68 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

Table of Contents
1 Ordering parts...........................................................................4
6.1 Core modules....................................................................20
1.1 Determining valid orderable parts......................................4
6.1.1 Debug trace timing specifications.......................21
2 Part identification......................................................................4
6.1.2 JTAG electricals..................................................21
2.1 Description.........................................................................4
6.2 System modules................................................................24
2.2 Format...............................................................................4
6.3 Clock modules...................................................................24
2.3 Fields.................................................................................4
6.3.1 MCG specifications.............................................24
2.4 Example............................................................................5
6.3.2 Oscillator electrical specifications.......................27
3 Terminology and guidelines......................................................5
6.3.3 32kHz Oscillator Electrical Characteristics.........29
3.1 Definition: Operating requirement......................................5
6.4 Memories and memory interfaces.....................................29
3.2 Definition: Operating behavior...........................................6
6.4.1 Flash (FTFL) electrical specifications.................30
3.3 Definition: Attribute............................................................6
6.4.2 EzPort Switching Specifications.........................34
3.4 Definition: Rating...............................................................7
6.4.3 Flexbus Switching Specifications........................35
3.5 Result of exceeding a rating..............................................7
6.5 Security and integrity modules..........................................37
3.6 Relationship between ratings and operating
6.6 Analog...............................................................................37
requirements......................................................................7
6.6.1 ADC electrical specifications..............................37
3.7 Guidelines for ratings and operating requirements............8
6.6.2 CMP and 6-bit DAC electrical specifications......45
3.8 Definition: Typical value.....................................................8
6.6.3 12-bit DAC electrical characteristics...................48
3.9 Typical value conditions....................................................9
6.6.4 Voltage reference electrical specifications..........51
4 Ratings......................................................................................9
6.7 Timers................................................................................52
4.1 Thermal handling ratings...................................................10
6.8 Communication interfaces.................................................52
4.2 Moisture handling ratings..................................................10
6.8.1 USB electrical specifications...............................53
4.3 ESD handling ratings.........................................................10
6.8.2 USB DCD electrical specifications......................53
4.4 Voltage and current operating ratings...............................10
6.8.3 USB VREG electrical specifications...................53
5 General.....................................................................................11
6.8.4 CAN switching specifications..............................54
5.1 Nonswitching electrical specifications...............................11
6.8.5 DSPI switching specifications (low-speed
5.1.1 Voltage and current operating requirements......11
mode)..................................................................54
5.1.2 LVD and POR operating requirements...............12
6.8.6 DSPI switching specifications (high-speed
5.1.3 Voltage and current operating behaviors............13
mode)..................................................................55
5.1.4 Power mode transition operating behaviors.......13
6.8.7 I2C switching specifications................................57
5.1.5 Power consumption operating behaviors............14
6.8.8 UART switching specifications............................57
5.1.6 EMC radiated emissions operating behaviors....17
6.8.9 SDHC specifications...........................................57
5.1.7 Designing with radiated emissions in mind.........18
6.8.10 I2S switching specifications................................58
5.1.8 Capacitance attributes........................................18
6.9 Human-machine interfaces (HMI)......................................60
5.2 Switching specifications.....................................................18
6.9.1 TSI electrical specifications................................60
5.2.1 Device clock specifications.................................18
7 Dimensions...............................................................................61
5.2.2 General switching specifications.........................19
7.1 Obtaining package dimensions.........................................61
5.3 Thermal specifications.......................................................19
8 Pinout........................................................................................62
5.3.1 Thermal operating requirements.........................19
8.1 K20 Signal Multiplexing and Pin Assignments..................62
5.3.2 Thermal attributes...............................................20
8.2 K20 Pinouts.......................................................................66
6 Peripheral operating requirements and behaviors....................20
9 Revision History........................................................................67
K20 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
3