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K20P121M100SF2 Datasheet, PDF (20/68 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz | |||
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Peripheral operating requirements and behaviors
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
TJ
TA
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
â40
125
°C
â40
°C
5.3.2 Thermal attributes
Board Symbol
type
Single-layer RθJA
(1s)
Four-layer RθJA
(2s2p)
Single-layer RθJMA
(1s)
Four-layer RθJMA
(2s2p)
â
RθJB
â
RθJC
â
ΨJT
Description
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./min.
air speed)
Thermal resistance, junction to ambient (200 ft./min.
air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter, junction to
package top outside center (natural convection)
121 Unit
MAPBGA
TBD
°C/W
TBD
°C/W
TBD
°C/W
TBD
°C/W
TBD
TBD
TBD
°C/W
°C/W
°C/W
Notes
1
1
1
1
2
3
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
ConditionsâNatural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental ConditionsâForced Convection (Moving Air).
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
1. output pins
⢠have CL=30pF loads,
⢠are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
⢠are configured for high drive strength (PORTx_PCRn[DSE]=1)
2. input pins
⢠have their passive filter disabled (PORTx_PCRn[PFE]=0)
6.1 Core modules
K20 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
20
Preliminary
Freescale Semiconductor, Inc.
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