K60P100M100SF2 Datasheet, PDF (21/73 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

4. 15pF load
Peripheral operating requirements and behaviors
5.3 Thermal specifications
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.3.2 Thermal attributes
Board Symbol Description
type
Single- R_θJA
layer (1s)
Thermal resistance, junction to ambient
(natural convection)
Four-
layer
(2s2p)
R_θJA
Thermal resistance, junction to ambient
(natural convection)
Single- R_θJMA
layer (1s)
Thermal resistance, junction to ambient
(200 ft./min. air speed)
Four-
layer
(2s2p)
R_θJMA
Thermal resistance, junction to ambient
(200 ft./min. air speed)
—
R_θJB
Thermal resistance, junction to board
—
R_θJC
Thermal resistance, junction to case
—
Ψ_JT
Thermal characterization parameter,
junction to package top outside center
(natural convection)
100
LQFP
TBD
81
80
MAPBGA LQFP
TBD
TBD
Unit
°C/W
TBD
TBD
TBD
°C/W
TBD
TBD
TBD
TBD
TBD
TBD
°C/W
°C/W
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
°C/W
°C/W
°C/W
Notes
1
1
1
1
2
3
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
1. output pins
• have C_L=30pF loads,
K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
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