MC68HC08JL8 Datasheet, PDF (195/212 Pages) Freescale Semiconductor, Inc – Microcontrollers

Chapter 18
Mechanical Specifications
18.1 Introduction
This section gives the dimensions for:
• 20-pin plastic dual in-line package (case #738)
• 20-pin small outline integrated circuit package (case #751D)
• 28-pin plastic dual in-line package (case #710)
• 28-pin small outline integrated circuit package (case #751F)
• 32-pin shrink dual in-line package (case #1376)
• 32-pin low-profile quad flat pack (case #873A)
18.2 20-Pin Plastic Dual In-Line Package (PDIP)
–A–
20
1
–T–
SEATING
PLANE
E
G
F
11
B
10
C
K
N
D 20 PL
0.25 (0.010) M T A M
L
M
J 20 PL
0.25 (0.010) M
TBM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E 0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L 0.300 BSC
7.62 BSC
M
0_{_} 15_{_} 0_{_} 15_{_}
N 0.020 0.040 0.51 1.01
Figure 18-1. 20-Pin PDIP (Case #738)
MC68HC908JL8/JK8 • MC68HC08JL8/JK8 • MC68HC908KL8 Data Sheet, Rev. 3.1
Freescale Semiconductor
195