FIN210AC Datasheet, PDF (15/17 Pages) Fairchild Semiconductor – 10-Bit Serializer / Deserializer Supporting Cameras and Small Displays up to 48MHz

Physical Dimensions
0.15 C
5.00
B
A
PIN #1 IDENT
0.80 MAX
0.10 C
0.08 C _0.05
0.00
SEATING
PLANE
PIN #1 IDENT
3.70
3.50
5.00
0.15 C
5.38 MIN
3.86 MIN
(0.20)
C
0.28 MAX
X40 E
0.50TYP
0.45
0.35
PIN #1 ID
(0.76)
(0.25 )
3.37 MAX
0.20MIN
X4
0.50
(DATUM B)
3.70
3.50
(DATUM A)
PIN #1 ID
0.50
0.18-0.30
0.10
0.05
CAB
C
NOTES:
A. CONFORMS TO JEDEC REGISTRATION MO-220, VARIATION
WHHD-4. THIS PACKAGE IS ALSO FOOTPRINT COMPATIBLE WITH
WHHD-5.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994.
D. LAND PATTERN PER IPC SM-782.
E. WIDTH REDUCED TO AVOID SOLDER BRIDGING.
F. DIMENSIONS ARE NOT INCLUSIVE OF BURRS, MOLD FLASH, OR
TIE BAR PROTRUSIONS.
G. DRAWING FILENAME: MKT-MLP32Arev3.
Figure 9. 32-Lead, Molded Leadless Package (MLP)
Order Number
FIN210ACMLX
Operating
Temperature Range
-30 to 70°C
Package Description
32-Terminal Molded Leadless Package (MLP), Quad,
JEDEC MO-220, 5mm Square
Eco
Status
Green
Packing
Method
Tape & Reel
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FIN210AC • Rev. 1.0.1
15
www.fairchildsemi.com