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NT5SV64M4AT Datasheet, PDF (36/65 Pages) List of Unclassifed Manufacturers – 256Mb Synchronous DRAM
NT5SV64M4AT(L)
NT5SV32M8AT(L)
NT5SV16M16AT(L)
256Mb Synchronous DRAM
Operating, Standby, and Refresh Currents (TA = 0 to +70°C, VDD = 3.3V ±0.3V)
Parameter
Symbol
Test Condition
Speed
-7K
-75B
-8B
Operating Current
1 bank operation
IC C 1
tR C = tRC(min), t CK = min
Active-Precharge command cycling with-
130
120
115
out burst operation
Precharge Standby Current
in Power Down Mode
Precharge Standby Current
in Non-Power Down Mode
No Operating Current
(Active state: 4 bank)
ICC2P
CKE ≤ VIL(max), tC K = min,
CS = V I H(min)
ICC2PS
CKE ≤ VIL(max), tC K = Infinity,
CS = V I H(min)
ICC2N
CKE ≥ VI H(min), tCK = min,
CS = VIH (min)
ICC2NS CKE ≥ VI H(min), tCK = Infinity,
ICC3N
CKE ≥ VI H(min), tCK = min,
CS = VIH (min)
ICC3P CKE ≤ VIL(max), tC K = min,
2
2
2
2
2
2
30
30
20
8
8
8
60
60
45
6
6
6
tCK = min,
Operating Current (Burst
Mode)
IC C 4
Read/ Write command cycling,
Multiple banks active, gapless data, BL =
120
120
90
4
Auto (CBR) Refresh Current
IC C 5
tCK = min, t R C = tRC(min)
CBR command cycling
175
175
155
Self Refresh Current
IC C 6
CKE ≤ 0.2V
SP
3
3
3
LP
1.2
1.2
1.2
Units Notes
mA 1, 2, 3
mA
1
mA
1
mA
1, 5
mA
1, 7
mA
1, 5
mA
1, 6
mA 1, 3, 4
mA
1
mA
1,8
mA
8
1. Currents given are valid for a single device. .
2. These parameters depend on the cycle rate and are measured with the cycle determined by the minimum value of tCK and tRC. Input sig-
nals are changed up to three times during tRC(min).
3. The specified values are obtained with the output open.
4. Input signals are changed once during tCK(min).
5. Input signals are changed once during three clock cycles.
6. Active Standby Current will be higher if Clock Suspend is entered during a burst read cycle (add 1mA per DQ).
7. Input signals are stable.
8. SP : Standard power ; LP : Lower power
REV 1.0
May, 2001
36
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