MC34921 Datasheet, PDF (7/36 Pages) List of Unclassifed Manufacturers – Configurable Motor Driver IC with Power Supplies

MAXIMUM RATINGS
Table 2. Maximum Ratings(continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Max
Unit
THERMAL RATINGS
Operating Temperature
Ambient
Junction
°C
T_A
-20 to 85
T_J
150
Storage Temperature
Thermal Resistance
Junction to Ambient⁽³⁾
Junction to Board⁽⁴⁾
Junction to Case
T_STG
R_θJA
R_θJB
R_θJC
-55 to 150
40
14
<1.0
°C
°C/W
Peak Package Reflow Temperature During Solder Mounting ⁽⁵⁾
T_SOLDER
245
°C
THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
Power Dissipation (T_A = 25° C) ⁽⁶⁾
P_D
2.0
W
Notes
3. 1s PCB test board JESD51-2 and SEMI G38-87.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured at the package
center lead foot. 2s2p test board, exposed pad soldered to PCB.
5. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.
6. Maximum power dissipation at indicated ambient temperature in free air with no heatsink used.
Analog Integrated Circuit Device Data
Freescale Semiconductor
34921
7