SI5311 Datasheet, PDF (23/24 Pages) List of Unclassifed Manufacturers – PRECISION HIGH SPEED CLOCK MULTIPLIER/REGENERATOR IC

Si5311
Package Outline
Figure 13 illustrates the package details for the Si5311. Table 15 lists the values for the dimensions shown in the
illustration.
TO P VIEW
A
D
2X
0.25
CA
BO TTO M VIEW
5
6
0.50 D IA .
D /2
D1
D 1 /2
N
1
2
3
2X
0.25
CB
E 1 /2
E /2
E1
E
A
A2
10
0.05 C
A1
A3
4X P
R
4X P
4X Q
4
b
0.10 M C A B
D2
D 2 /2
N
8.
1
2
(N e-1 )X e
3
E2
REF.
0.20 C B
2X
0.20 C A
2X
CL
e
T E R M IN A L T IP
FO R O DD TERM INAL/SIDE
E 2 /2
L
B
0
CC
CL
b
A1
4
SECTIO N "C-C"
SCALE: NONE
11
1.
2.
3.
e
4.
5.
FO R EVEN TERM INAL/SIDE
6.
C
S E A T IN G
PLANE
e
(N d -1 )X e
REF.
NOTES:
DIE THICKNESS ALLOW ABLE IS 0.305mm MAXIMUM(.012 INCHES MAXIMUM)
DIMENSIONING & TOLERANCES CONFORM TO ASME Y14.5M. - 1994.
N IS THE NUMBER OF TERMINALS.
Nd IS THE NUMBER OF TERMINALS IN X-DIRECTION &
Ne IS THE NUMBER OF TERMINALS IN Y-DIRECTION.
DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED
BETW EEN 0.20 AND 0.25mm FROM TERMINAL TIP.
THE PIN #1 IDENTIFIER MUST BE EXISTED ON THE TOP SURFACE OF THE
PACKAGE BY USING INDENTATION MARK OR OTHER FEATURE OF PACKAGE BODY.
EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL.
7. ALL DIMENSIONS ARE IN MILLIMETERS.
8. THE SHAPE SHOW N ON FOUR CORNERS ARE NOT ACTUAL I/O.
9. PACKAGE W ARPAGE MAX 0.05mm.
10. APPLIED FOR EXPOSED PAD AND TERMINALS.
EXCLUDE EMBEDDING PART OF EXPOSED
PAD FROM MEASURING.
11. APPLIED ONLY FOR TERMINALS.
Figure 13. 20-pin Micro Leaded Package (MLP)
Symbol
A
A1
A2
A3
b
D
D1
D2
e
E
Table 15. Package Diagram Dimensions
Millimeters
Symbol
Millimeters
Min
Nom
Max
—
0.85
1.00
0.00
0.01
0.05
—
0.65
0.80
0.20 REF
0.18
—
0.30
4.00 BSC
3.75 BSC
1.95
2.10
2.25
0.50 BSC
4.00 BSC
Min
Nom
Max
E1
3.75 BSC
E2
1.95
2.10
2.25
N
20
Nd
5
Ne
5
L
0.50
0.60
0.75
P
0.24
0.42
0.60
Q
0.30
0.40
0.65
R
0.13
0.17
0.23
θ
—
—
12°
Preliminary Rev. 0.6
23