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M13S2561616A-2S Datasheet, PDF (9/49 Pages) Elite Semiconductor Memory Technology Inc. – Double-data-rate architecture, two data transfers per clock cycle
ESMT
M13S2561616A (2S)
Operation Temperature Condition -40°C~85°C
AC Timing Parameter & Specifications (Note: 1~6, 9~10)
Parameter
Clock period
CL2.5
CL3
CL4
DQ output access time from CLK/ CLK
CLK high-level width
CLK low-level width
DQS output access time from
CLK/ CLK
Clock to first rising edge of DQS delay
DQ and DM input setup time (to DQS)
DQ and DM input hold time (to DQS)
DQ and DM input pulse width (for each
input)
Address and Control input setup time
(fast)
Address and Control input hold time
(fast)
Address and Control input setup time
(slow)
Address and Control input hold time
(slow)
Control and Address input pulse width
(for each input)
DQS input high pulse width
DQS input low pulse width
DQS falling edge to CLK setup time
DQS falling edge hold time from CLK
Data strobe edge to output data edge
Data-out high-impedance time from
CLK/ CLK
Data-out low-impedance time from
CLK/ CLK
Clock half period
DQ/DQS output hold time from DQS
Data hold skew factor
Symbol
tCK
tAC
tCH
tCL
tDQSCK
tDQSS
tDS
tDH
tDIPW
-5
min
max
5
12
5
12
5
12
-0.7
+0.7
0.45
0.55
0.45
0.55
-0.6
+0.6
0.72
1.25
0.4
0.4
1.75
tIS
0.6
tIH
0.6
tIS
0.8
tIH
0.8
tIPW
tDQSH
tDQSL
tDSS
tDSH
tDQSQ
tHZ
2.2
0.35
0.35
0.2
0.2
0.4
+0.7
tLZ
tHP
tQH
tQHS
-0.7
+0.7
tCLmin
or
tCHmin
tHP- tQHS
0.5
-6
min
max
6
12
6
12
6
12
-0.7
+0.7
0.45
0.55
0.45
0.55
-0.6
+0.6
0.72
1.25
0.4
0.4
1.75
0.6
0.6
0.8
0.8
2.2
0.35
0.35
0.2
0.2
0.4
+0.7
-0.7
+0.7
tCLmin
or
tCHmin
tHP- tQHS
0.5
Unit Note
ns
ns
tCK
tCK
ns
tCK
ns
ns
ns
18
ns
15,
17~19
ns
15,
17~19
ns 16~19
ns 16~19
ns
18
tCK
tCK
tCK
tCK
ns
22
ns
11
ns
11
ns 20,21
ns
21
ns
Elite Semiconductor Memory Technology Inc.
Publication Date : Jan. 2015
Revision : 1.0
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