SED1565 Datasheet, PDF (6/87 Pages) Epson Company – Direct display of RAM data through the display data RAM

SED1565 Series
PIN DIMENSIONS
99
100
134
135
Chip Size
Bump Pitch
Bump Size
Bump Height
Chip Thickness
SED1565 Series
(0, 0)
1
309
Die No.
10.82 mm × 2.81 mm
71 µm (Min.)
PAD No. 1~24
PAD No. 25~82
PAD No. 83~99
PAD No. 100
PAD No. 101~133
PAD No. 134
PAD No. 135
PAD No. 136~273
PAD No. 274
PAD No. 275
PAD No. 276~308
PAD No. 309
17 µm (Typ.)
625 µm
85 µm × 85 µm
64 µm × 85 µm
85 µm × 85 µm
85 µm × 73 µm
85 µm × 47 µm
85 µm × 73 µm
73 µm × 85 µm
47 µm × 85 µm
73 µm × 85 µm
85 µm × 73 µm
85 µm × 47 µm
85 µm × 73 µm
275
274
8–4
EPSON