EPC901 Datasheet, PDF (33/37 Pages) Espros Photonics corp – CCD line sensor 1024x1 pixel

14. Tape & Reel Information
The devices are mounted on embossed tape for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13
inch) reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and in-
dicate the tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association
(EIA) standard 481-1, 481-2, 481-3.
CSP32 Tape
Pin 1
4
epc does
picking.
not
guarantee
that
C^thS^eP^r6^eT^aap^ree
no
empty
cavities. Thus,
Pin 1
the
pick-a_Qn_Fd_N-p₁l₆a_Tc_ae_pemachine
should
check
Pin 1
the
presence
of
a
chip
during
14.1. Soldering and IC handling
Since the chip is only 50μm thick and has a high aspect ratio (length to width), a careful handling during the surface mount assembly
process shall be taken in order to avoid mechanical damage. In addition to that, careful PCB layout is needed in order to achieve reliable
assembly results with a high yield. Please refer to the application note AN04 from epc which contains comprehensive information to these
topics. This application note can be downloaded at www.espros.com/application-notes.
4
Item
Solder balls: Alloy
Soldering profile
Soldering lead temperature
Allowed cleaning agents
Packaging technology
Pick and place
Description
8
Sn96.5Ag3.0Cu0.5 (SAC305)
For infrared or conventional soldering, the solder profile has to follow the recommendations of
IPC/JEDEC J-STD020C (revision C and later) for lead-free assembly.
TL = 260 ºC for 4s with a maximum gradient of 6 ºC/s
Isopropanol
Bare-die CSP with underfill
F
Z
Nozzle
F
Z
✔
Chip
Solder ball
✔
✘
F
✔ ^SH_B
Vacuum
✘
✘^F
SH_B
Figure 18: Pick & place; left: good nozzle, good picking; right: bad nozzle, bad picking
The nozzle needs a flat surface. It must not touch the pixel-field area.
It should not have any flashes where it touches the chip. The chip can get damaged.
The nozzle has to bring the FZ force evenly distributed in a vertical way to the center of the solder
balls during picking and placing. Refer to Figure 18, left picture. It means that it should be large
enough so that it picks the chip not just in the middle of the part but in the area above the solder balls.
Bending of the chip is not allowed. Refer toFigure 18, right picture
Keep attention having no shear forces to the solder balls during picking the chip from the tape pocket
and/or placing.
Maximum vertical force FZ per chip: ≤ 0.8 N.
Maximum shear force FSH_B per ball: ≤ 0.5 N.
Preferred is forceless picking with vacuum only.
It is also highly recommended to use a „kiss-and-goodbye“ concept to place the component. It means
that the nozzle should blow the part away when it does the placing.
Table 30: IC handling specification
© 2016 ESPROS Photonics Corporation
Characteristics subject to change without notice
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