EPC901 Datasheet, PDF (30/37 Pages) Espros Photonics corp – CCD line sensor 1024x1 pixel

13. Layout and packaging information
13.1. Mechanical dimensions
The packaging technology is a CSP with a uBGA. All measures which do not have an explicit tolerance are meant +/-0.001mm.
Photosensitive side
(top view)
PCB side
Solder balls Sn96.5Ag3.0Cu0.5
(SAC305)
8.000 ±0.040
4.000 ±0.020
1024 x 0.0075 = 7.680
0.0075 _{photosensitive area}
center of pixel-field
32
17
Pixel #0
Pixel #1023
top view (view to photosensitive side)
(ball size:  0.200)
1
16
(0.250 ±0.020)
(0.090)
0.500
3.750
15 x 0.500 = 7.500
Weight: 4.57 mg
- measures in mm
- not specified tolerances ±0.001
The following picture shows the epc901 chip from the bottom side with view to the solder balls. Please note the location of pin 1 and
pin 32.
Pin 1
13.2. Location of the photosensitive area
The photosensitive area is not marked neither on the front nor on the backside of the IC. As a visible reference, a metal ring of the IC can
be used. From the back side (solder ball side) it is visible. Also from the front side (photosensitive area) it can be seen with a camera which
is sensitive in the near infrared wavelength domain (950 .. 1150nm).
© 2016 ESPROS Photonics Corporation
Characteristics subject to change without notice
30 / 37
Datasheet_epc901-V5.6
www.espros.com