EPC901 Datasheet, PDF (2/37 Pages) Espros Photonics corp – CCD line sensor 1024x1 pixel

Table of Contents
1. Block diagram.....................................................................................................................................................3
2. Pin-out................................................................................................................................................................4
2.1. Pin assignment....................................................................................................................................................................................4
2.2. Pin table...............................................................................................................................................................................................4
2.3. Power domain separation and ESD protection...................................................................................................................................5
3. Electrical, optical and timing characteristics............................................................................................................6
3.1. Recommended operating conditions...................................................................................................................................................6
3.2. System characteristics.........................................................................................................................................................................6
3.3. Electrical characteristics......................................................................................................................................................................6
3.4. Temperature sensor characteristics....................................................................................................................................................7
3.5. Timing parameters...............................................................................................................................................................................8
3.6. Absolute maximum ratings..................................................................................................................................................................8
3.7. Optical characteristics..........................................................................................................................................................................9
3.7.1. Typical spectral range and quantum efficiency (QE).....................................................................................................................10
3.8. Frequency response..........................................................................................................................................................................10
4. Chip configuration.............................................................................................................................................11
4.1. Configuration pin description.............................................................................................................................................................11
4.2. Dynamic change of the configuration pins........................................................................................................................................12
4.3. Charge pump on/off through DATA_RDY strap pin..........................................................................................................................12
4.4. Frequency response setting..............................................................................................................................................................12
5. Imager operation................................................................................................................................................13
5.1. General remarks................................................................................................................................................................................13
5.2. Image acquisition...............................................................................................................................................................................13
5.3. Multi frame acquisition.......................................................................................................................................................................14
5.4. Image readout....................................................................................................................................................................................14
5.5. Readout configuration........................................................................................................................................................................15
5.6. Periodic flushing................................................................................................................................................................................15
5.7. Clearing the CCD pixel field and the CCD frame store with CLR_DATA..........................................................................................15
6. Temperature sensor...........................................................................................................................................16
7. Power-down mode.............................................................................................................................................16
8. Chip reset......................................................................................................................................................... 16
9. Measuring the internal oscillator clock frequency...................................................................................................16
10. I2C interface.................................................................................................................................................... 17
10.1. I2C communication..........................................................................................................................................................................17
10.1.1. Device addressing........................................................................................................................................................................17
10.1.2. Single-byte write...........................................................................................................................................................................17
10.1.3. Multi-byte write..............................................................................................................................................................................17
10.1.4. Single-byte read............................................................................................................................................................................18
10.1.5. Multi-byte read..............................................................................................................................................................................18
10.1.6. Software reset...............................................................................................................................................................................18
10.1.7. Re-sampling the device address..................................................................................................................................................18
10.2. Setup latency...................................................................................................................................................................................18
10.3. I2C register description....................................................................................................................................................................19
10.4. I2C bus timing..................................................................................................................................................................................26
11. Application information.....................................................................................................................................27
11.1. Circuit for differential mode..............................................................................................................................................................27
11.2. Circuit for single ended mode..........................................................................................................................................................28
11.3. External components.......................................................................................................................................................................28
11.4. Low noise operation.........................................................................................................................................................................28
11.4.1. Charge pump noise......................................................................................................................................................................28
11.4.2. Video amplifier noise....................................................................................................................................................................28
12. Power consumption considerations....................................................................................................................29
12.1. General considerations....................................................................................................................................................................29
12.2. Low power operation with external 3V and 5V supply....................................................................................................................29
13. Layout and packaging information......................................................................................................................30
13.1. Mechanical dimensions...................................................................................................................................................................30
13.2. Location of the photosensitive area.................................................................................................................................................30
13.3. Layout recommendations................................................................................................................................................................31
13.3.1. Electrical.......................................................................................................................................................................................31
13.3.2. PCB design and SMD manufacturing process considerations....................................................................................................32
14. Tape & Reel Information....................................................................................................................................33
14.1. Soldering and IC handling...............................................................................................................................................................33
15. Self-test mode by fill-and-spill............................................................................................................................34
15.1. Important notes to fill-and-spill.........................................................................................................................................................35
16. Ordering Information........................................................................................................................................36
17. Note to various chip releases.............................................................................................................................36
17.1. epc901-007 up to -016, -018, -020, -021, -022, -023......................................................................................................................36
17.2. epc901-007 up to -016, -018, -020, -021, -022...............................................................................................................................36
17.3. epc901-016......................................................................................................................................................................................36
17.4. epc901-007 up to and including -018, -020, -022...........................................................................................................................36
17.5. epc901-031......................................................................................................................................................................................36
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Characteristics subject to change without notice
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Datasheet_epc901-V5.6
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