CMX994 Datasheet, PDF (60/61 Pages) CML Microcircuits – Local Oscillator

Direct Conversion Receivers
9.3 Packaging
Exposed
Metal Pad
CMX994/CMX994A/CMX994E
DIM.
*^A
*^B
C
F
G
H
J
K
L
L1
P
T
MIN. TYP. MAX.
0.80
4.00
4.00
0.00
0.18
0.20
0.30
0
6.00 BSC
6.00 BSC
0.90
0.25
0.40
0.50
0.20
1.00
4.30
4.30
0.05
0.30
0.50
0.15
NOTE :
* A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
Index Area 1
Index Area 2
Dot
Dot
Chamfer
Index Area 1 is located directly above Index Area 2
Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.
L minus L1 to be equal to, or greater than 0.3mm
The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal
conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also
be required
Notes:
1. In this device, the underside of the Q4 package should be electrically connected to the analogue ground. The circuit
board should be designed so that no unwanted short circuits can occur.
2. As package dimensions may change after publication of this datasheet, it is recommended that you check for the
latest Packaging Information from the Datasheets page of the CML website: [www.cmlmicro.com].
Figure 31 Q4 Mechanical Outline
Order as part no.CMX994Q4
CMX994AQ4
CMX994EQ4
 2015 CML Microsystems Plc
Page 60 of 70
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