EP7309 Datasheet, PDF (31/46 Pages) Cirrus Logic – HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE

Table T. 204-Ball TFBGA Ball List (Continued)
Die Pad Bond Pad Package Ball
Signal
Y1
GNDR
Y2
GNDR
Y3
GNDR
EP7309
High-Performance, Low-Power System on Chip
256-Ball PBGA Package Characteristics
256-Ball PBGA Package Specifications
Figure 13. 256-Ball PBGA Package
Note: 1) For pin locations see Table U.
2) Dimensions are in millimeters (inches), and controlling dimension is millimeter
3) Before beginning any new EP7309 design, contact Cirrus Logic for the latest package information.
DS507PP1
Copyright 2001 Cirrus Logic (All Rights Reserved)
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