EP7309 Datasheet, PDF (30/46 Pages) Cirrus Logic – HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE

EP7309
High-Performance, Low-Power System on Chip
Table T. 204-Ball TFBGA Ball List (Continued)
Die Pad Bond Pad Package Ball
Signal
U2.155
154
U2.156
155
U2.157
156
U2.158
157
U2.159
158
U2.160
159
U2.161
160
U2.162
161
U2.163
162
U2.164
163
U2.165
164
U2.166
165
U2.167
166
U2.168
167
U2.169
168
U2.170
169
U2.171
170
U2.172
171
U2.173
172
U2.174
173
U2.175
174
U2.176
175
U2.177
176
U2.178
177
U2.179
178
U2.180
179
U2.181
180
U2.182
181
U2.183
182
U2.184
183
U2.185
184
U2.186
185
U2.187
186
U2.188
187
U2.189
188
U2.190
189
U2.191
190
U2.192
191
U2.193
192
C20
nPOR
E18
nMEDCHG/nBROM
B20
nURESET
C17
VDDO
B17
MOSCIN
A17
MOSCOUT
C16
GNDO
B16
WAKEUP
A16
nPWRFL
C15
A6
B15
D6
A15
A5
C14
D5
A1
VDDR
Y3
GNDR
B14
A4
A14
D4
C13
A3
B13
D3
A13
A2
Y3
GNDR
C12
D2
B12
A1
A12
D1
C11
A0
B11
D0
A11
GNDD
C10
VDDD
Y3
GNDR
Y20
VDDR
B10
CL2
A10
CL1
A9
FRM
B9
M
C9
DD3
A8
DD2
Y3
GNDR
B8
DD1
C8
DD0
Table T. 204-Ball TFBGA Ball List (Continued)
Die Pad Bond Pad Package Ball
Signal
U2.194
193
U2.195
194
U2.196
195
U2.197
196
U2.198
197
U2.199
198
U2.200
199
U2.201
200
U2.202
201
U2.203
202
U2.204
203
U2.205
204
U2.206
205
U2.207
206
U2.208
207
U2.209
208
A7
B7
C7
A6
V18
B18
B6
C6
A5
B5
B18
C5
A4
B4
A3
C4
A1
B2
C3
D3
K3
L18
V18
V19
W19
Y20
A18
A19
A20
B18
B19
C18
D18
V2
V3
W1
W2
W3
N/C
N/C
N/C
N/C
VDDR
GNDR
N/C
N/C
nMWE
nMOE
GNDR
nCS0
nCS1
nCS2
nCS3
nCS4
VDDR
VDDR
VDDR
VDDR
VDDR
VDDR
VDDR
VDDR
VDDR
VDDR
GNDR
GNDR
GNDR
GNDR
GNDR
GNDR
GNDR
GNDR
GNDR
GNDR
GNDR
GNDR
30
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