EP7309 Datasheet, PDF (28/46 Pages) Cirrus Logic – HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE

EP7309
High-Performance, Low-Power System on Chip
TFBGA Ball List
Die Pad
U2.1
U2.2
U2.3
U2.4
U2.5
U2.6
U2.7
U2.8
U2.9
U2.10
U2.11
U2.12
U2.13
U2.14
U2.15
U2.16
U2.17
U2.18
U2.19
U2.20
U2.21
U2.22
U2.23
U2.24
U2.25
U2.26
U2.27
U2.28
U2.29
U2.30
U2.31
U2.32
U2.33
U2.34
U2.35
U2.36
U2.37
Table T. 204-Ball TFBGA Ball List
Bond Pad Package Ball
Signal
1
B3
nCS5
2
Y20
VDDR
3
B18
GNDR
4
A2
EXPCLK
5
B1
WORD
6
E3
WRITE
7
C1
RUN/CLKEN
8
C2
EXPRDY
9
E2
TXD2
10
D2
RXD2
11
F3
TDI
12
B18
GNDR
13
D1
PB7
14
F2
PB6
15
G3
PB5
16
E1
PB4
17
F1
PB3
18
G2
PB2
19
G1
PB1
20
H3
PB0
21
Y20
VDDR
22
H2
TDO
23
H1
PA7
24
J3
PA6
25
J2
PA5
26
J1
PA4
27
L3
PA3
28
K2
PA2
29
K1
PA1
30
M3
PA0
31
L2
LEDDRV
32
L1
TXD1
33
B18
GNDR
34
N3
PHDIN
35
M2
CTS
36
M1
RXD1
37
P3
DCD
Table T. 204-Ball TFBGA Ball List (Continued)
Die Pad Bond Pad Package Ball
Signal
U2.38
38
U2.39
39
U2.40
40
U2.41
41
U2.42
42
U2.43
43
U2.44
44
U2.45
45
U2.46
46
U2.47
47
U2.48
48
U2.49
49
U2.50
50
U2.51
51
U2.53
52
U2.54
53
U2.55
54
U2.56
55
U2.57
56
U2.58
57
U2.59
58
U2.60
59
U2.61
60
U2.62
61
U2.63
62
U2.64
63
U2.65
64
U2.66
65
U2.67
66
U2.68
67
U2.69
68
U2.70
69
U2.71
70
U2.72
71
U2.73
72
U2.74
73
U2.75
74
U2.76
75
N1
N2
R3
P1
P2
T3
R1
R2
T1
T2
U1
U2
U3
V1
V4
W4
Y4
V5
L18
W5
Y5
V6
W6
Y6
V7
D18
W7
Y7
V8
W8
Y8
V9
W9
Y9
W3
V10
L18
W10
DSR
nTEST1
nTEST0
EINT3
nEINT2
nEINT1
nEXTFIQ
PE2/CLKSEL
PE1/BOOTSEL1
PE0/BOOTSEL0
GNDC
RTCOUT
RTCIN
VDDC
PD7
PD6
PD5
PD4
VDDR
TMS
PD3
PD2
PD1
PD0/LEDFLSH
SSICLK
GNDR
SSITXFR
SSITXDA
SSIRXDA
SSIRXFR
ADCIN
nADCCS
GNDD1
VDD1
GNDR
VDDR
VDDR
DRIVE1
28
Copyright 2001 Cirrus Logic (All Rights Reserved)
DS507PP1