EP7309 Datasheet, PDF (21/46 Pages) Cirrus Logic – HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE

Packages
208-Pin LQFP Package Characteristics
208-Pin LQFP Package Specifications
29.60 (1.165)
30.40 (1.197)
27.80 (1.094)
28.20 (1.110)
EP7309
High-Performance, Low-Power System on Chip
0.17 (0.007)
0.27 (0.011)
29.60 (1.165)
30.40 (1.197)
0.50
(0.0197)
BSC
Pin 208
Pin 1
EP7309
208-Pin LQFP
Pin 1 Indicator
27.80 (1.094)
28.20 (1.110)
0.45 (0.018)
0.75 (0.030)
1.35 (0.053)
1.45 (0.057)
1.00 (0.039) BSC
0.09 (0.004)
0.20 (0.008)
1.40 (0.055)
1.60 (0.063)
0.05 (0.002)
0.15 (0.006)
0° MIN
7° MAX
Figure 10. 208-Pin LQFP Package Outline Drawing
Note:
1) Dimensions are in millimeters (inches), and controlling dimension is millimeter.
2) Drawing above does not reflect exact package pin count.
3) Before beginning any new design with this device, please contact Cirrus Logic for the latest package information.
4) For pin locations, please see Figure 11. For pin descriptions see the EP7309 User’s Manual.
DS507PP1
Copyright 2001 Cirrus Logic (All Rights Reserved)
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