EP7309 Datasheet, PDF (29/46 Pages) Cirrus Logic – HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE

Table T. 204-Ball TFBGA Ball List (Continued)
Die Pad Bond Pad Package Ball
Signal
U2.77
76
U2.78
77
U2.79
78
U2.80
79
U2.81
80
U2.82
81
U2.83
82
U2.84
83
U2.85
84
U2.86
85
U2.87
86
U2.88
87
U2.89
88
U2.90
89
U2.91
90
U2.92
91
U2.93
92
U2.94
93
U2.95
94
U2.96
95
U2.97
96
U2.98
97
U2.99
98
U2.100
99
U2.101
100
U2.102
101
U2.103
102
U2.104
103
U2.105
104
U2.106
105
U2.107
106
U2.108
107
U2.109
108
U2.110
109
U2.111
110
U2.112
111
U2.113
112
U2.114
113
U2.115
114
Y10
V11
W11
Y11
Y12
Y3
W12
V12
Y13
W13
V13
Y14
W14
A1
V14
Y15
W15
V15
Y16
W16
V16
Y17
Y3
W17
Y18
V17
W18
Y19
W20
U18
V20
A1
Y3
U19
U20
T19
T20
R19
R20
DRIVE0
ADCCLK
ADCOUT
SMPLCK
FB1
GNDR
FB0
COL7
COL6
COL5
COL4
COL3
COL2
VDDR
TCLK
COL1
COL0
BUZ
D31
D30
D29
D28
GNDR
A27
D27
A26
D26
A25
D25
HALFWORD
A24
VDDR
GNDR
D24
A23
D23
A22
D22
A21
EP7309
High-Performance, Low-Power System on Chip
Table T. 204-Ball TFBGA Ball List (Continued)
Die Pad Bond Pad Package Ball
Signal
U2.116
115
U2.117
116
U2.118
117
U2.119
118
U2.120
119
U2.121
120
U2.122
121
U2.123
122
U2.124
123
U2.125
124
U2.126
125
U2.127
126
U2.128
127
U2.129
128
U2.130
129
U2.131
130
U2.132
131
U2.133
132
U2.134
133
U2.135
134
U2.136
135
U2.137
136
U2.138
137
U2.139
138
U2.140
139
U2.141
140
U2.142
141
U2.143
142
U2.144
143
U2.145
144
U2.146
145
U2.147
146
U2.148
147
U2.149
148
U2.150
149
U2.151
150
U2.152
151
U2.153
152
U2.154
153
T18
Y3
P19
P20
R18
N19
N20
P18
A1
Y3
M20
M19
N18
L20
L19
M18
K20
K19
K18
J20
J19
H20
H19
J18
K3
Y3
G20
H18
F20
G19
E20
F19
G18
D20
Y3
F18
D19
E19
C19
D21
GNDR
A20
D20
A19
D19
A18
D18
VDDR
GNDR
nTRST
A17
D17
A16
D16
A15
D15
A14
D14
A13
D13
A12
D12
A11
VDDR
GNDR
D11
A10
D10
A9
D9
A8
D8
A7
GNDR
D7
nBATCHG
nEXTPWR
BATOK
DS507PP1
Copyright 2001 Cirrus Logic (All Rights Reserved)
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