EP7309 Datasheet, PDF (26/46 Pages) Cirrus Logic – HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE

EP7309
High-Performance, Low-Power System on Chip
204-Ball TFBGA Package Characteristics
204-Ball TFBGA Package Specifications
TOP VIEW
A1 CORNER
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
C
SEATING PLANE
Ø0.08 M C
BOTTOM VIEW
Ø0.15 M C A B
Ø0.25~0.35(204X)
A1 CORNER
20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
B
0.65
12.35
13±0.05
0.15(4X) C
Ball Pitch :
Ball Diameter :
Substrate Thickness :
0.65
0.36
Mold Thickness :
0.3
0.53
Figure 12. 204-Ball TFBGA Package
26
Copyright 2001 Cirrus Logic (All Rights Reserved)
DS507PP1