DAC8560 Datasheet, PDF (26/29 Pages) Burr-Brown (TI) – 16-Bit, Ultra-Low Glitch, Voltage Output DIGITAL-TO-ANALOG CONVERTER with 2.5V, 2ppm/°C Internal Reference

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PACKAGE OPTION ADDENDUM
8-Jan-2007
PACKAGING INFORMATION
Orderable Device
DAC8560IADGKR
DAC8560IADGKRG4
DAC8560IADGKT
DAC8560IADGKTG4
DAC8560IBDGKR
DAC8560IBDGKRG4
DAC8560IBDGKT
DAC8560IBDGKTG4
DAC8560ICDGKR
DAC8560ICDGKRG4
DAC8560ICDGKT
DAC8560ICDGKTG4
DAC8560IDDGKR
DAC8560IDDGKRG4
DAC8560IDDGKT
DAC8560IDDGKTG4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
MSOP
Package
Drawing
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
MSOP
DGK
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
8 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1