DAC8560 Datasheet, PDF (2/29 Pages) Burr-Brown (TI) – 16-Bit, Ultra-Low Glitch, Voltage Output DIGITAL-TO-ANALOG CONVERTER with 2.5V, 2ppm/°C Internal Reference

DAC8560
SLAS464 – DECEMBER 2006
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGING/ORDERING INFORMATION⁽¹⁾
PRODUCT
DAC8560A
DAC8560B
DAC8560C
DAC8560D
MAXIMUM
RELATIVE
ACCURACY
(LSB)
±12
±8
±12
±8
MAXIMUM
DIFFERENTIAL
NONLINEARITY
(LSB)
±1
±1
±1
±1
MAXIMUM
REFERENCE
DRIFT
(ppm/°C)
25
25
5
5
PACKAGE-
LEAD
MSOP-8
PACKAGE
DESIGNATOR
DGK
SPECIFIED
TEMPERATURE PACKAGE
RANGE
MARKING
–40°C TO +105°C D860
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_DD to GND
Digital input voltage to GND
V_OUT to GND
Operating temperature range
Storage temperature range
Junction temperature range (T_J max)
Power dissipation (DGK)
Thermal impedance, θ_JA
Thermal impedance, θ_JC
ESD rating
Human body model (HBM)
Charged device model (CDM)
UNIT
–0.3V to 6V
–0.3V to +V_DD + 0.3V
–0.3V to +V_DD + 0.3V
–40°C to +105°C
–65°C to +150°C
+150°C
(T_J max – T_A)/θ_JA
206°C/W
44°C/W
4000V
1500V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2
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