AT17LV256 Datasheet, PDF (14/24 Pages) ATMEL Corporation – FPGA Configuration EEPROM Memory

Thermal Resistance Coefficients⁽¹⁾
Package Type
8CN4 Leadless Array Package (LAP)
8P3 Plastic Dual Inline Package (PDIP)
8S1
Plastic Gull Wing Small Outline
(SOIC)
20J
Plastic Leaded Chip Carrier
(PLCC)
20S2
Plastic Gull Wing Small Outline
(SOIC)
44A
Thin Plastic Quad Flat Package
(TQFP)
44J
Plastic Leaded Chip Carrier
(PLCC)
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
AT17LV65/
AT17LV128/
AT17LV256
45
115.71
37
107
45
150
35
90
–
–
–
–
AT17LV512/
AT17LV010
45
135.71
37
107
–
–
35
90
–
–
–
–
AT17LV002
45
159.60
–
–
–
–
35
90
17
62
15
50
AT17LV040
–
–
–
–
–
–
–
–
–
–
17
62
15
50
Notes: 1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
14 AT17LV65/128/256/512/010/002/040
2321E–CNFG–06/03