AT17C002 Datasheet, PDF (13/19 Pages) ATMEL Corporation – FPGA Configuration EEPROM Memory

AT17C/LV002
Thermal Resistance Coefficients⁽¹⁾
Package Type
Leadless Array Package
(LAP)
Plastic Leaded Chip Carrier
(PLCC)
Thin Plastic Quad Flat
Package (TQFP)
Plastic Leaded Chip Carrier
(PLCC)
8CN4
20J
44A
44J
θ_JC [°C/W]
45
35
17
15
θ_JA [°C/W]
Airflow = 0 ft/min
159.60
90
62
50
Note: 1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site, at
http://www.atmel.com/atmel/acrobat/doc0636.pdf.
13
2281D–12/01