TMD4903 Datasheet, PDF (77/86 Pages) ams AG – Color and Proximity Sensor Module with mobeam

TMD4903 − Soldering & Storage Information
Soldering & Storage
Information
Figure 87:
Solder Reflow Profile
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Parameter
Average temperature gradient in preheating
Soak time
Time above 217 °C (T1)
Time above 230 °C (T2)
Time above T_peak – 10 °C (T3)
Peak temperature in reflow
Temperature gradient in cooling
Reference
t_soak
t₁
t₂
t₃
T_peak
Device
2.5 °C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260 °C
Max -5 °C/sec
Figure 88:
Solder Reflow Profile Graph
T_peak
T₃
T₂
T₁
NottoScale
Timeinseconds
ams Datasheet
[v1-12] 2015-May-14
t₃
t₂
Page 77
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