AK8998 Datasheet, PDF (4/59 Pages) Asahi Kasei Microsystems – Preliminary

[AK8998/W/D]
Pin Configuration
1. Wafer Configuration
1) Die size
2) Die thickness
3) PAD size
4) PAD pitch
5) Scribe size
6) Wafer size
2.082mm x 1.662mm
280µm
80µm x 80µm
150µm<
80µm
6 inch
Pin numbers and Pad position
No. Pin Name
1 VSS
2 VO
3 VOUT
4 VDD
5 AGND
6 N.C.
7 N.C.
8 N.C.
X Location
(µm)
-894.8
-894.8
-894.8
-894.8
-521.7
Y Location No. Pin Name
(µm)
687.2
9 CSCLK
337.8
10 DET1
-344.7 11 DET2/PTH
-687.1 12 N.C.
-684.8 13 VN
14 VS
15 VP
16 EXTMP
X Location
(µm)
894.8
894.8
894.8
749.3
363.4
-236.7
-716.4
Y Location
(µm)
-544.7
-242.5
-57.9
684.8
684.8
684.8
684.8
Pad locations (Top view)
1 16
15
14
13
2
Y
X
11
(0,0)
3
10
4
5
9
2. Package Outline (UQFN16)
13 VN
14 VS
15 VP
16 EXTMP
8 N.C.
7 N.C.
6 N.C.
5 AGND
MSxxxxx-E-00
-4-
2012/11