EVAL-ADM1275EBZ Datasheet, PDF (8/48 Pages) Analog Devices – Hot-Swap Controller and Digital Power

ADM1275
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VCC Pin
UV Pin
OV Pin
SS Pin
TIMER Pin
VCAP Pin
ISET Pin
LATCH Pin
SCL Pin
SDA Pin
ADR Pin
GPO1/ALERT1/CONV Pin, ENABLE Pin
GPO2/ALERT2 Pin
PWRGD Pin
FLB Pin
VOUT Pin
GATE Pin (Internal Supply Only)¹
SENSE+ Pin
SENSE− Pin
VSENSE (VSENSE+ − VSENSE−)
Continuous Current into Any Pin
Storage Temperature Range
Operating Temperature Range
Lead Temperature, Soldering (10 sec)
Junction Temperature
Rating
−0.3 V to +25 V
−0.3 V to +4 V
−0.3 V to +4 V
−0.3 V to VCAP + 0.3 V
−0.3 V to VCAP + 0.3 V
−0.3 V to +4 V
−0.3 V to VCAP + 0.3 V
−0.3 V to +25 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to VCAP + 0.3 V
−0.3 V to +25 V
−0.3 V to +25 V
−0.3 V to +25 V
−0.3 V to +25 V
−0.3 V to +25 V
−0.3 V to +36 V
−0.3 V to +25 V
−0.3 V to +25 V
±0.3 V
±10 mA
−65°C to +125°C
−40°C to +85°C
300°C
150°C
1 _{The GATE pin has internal clamping circuits to prevent the GATE pin voltage}
from exceeding the maximum ratings of a MOSFET with VGSMAX = 20 V and
internal process limits. Applying a voltage source to this pin externally may
cause irreversible damage.
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
16-lead QSOP (RQ-16)
150
20-lead QSOP (RQ-20)
126
20-lead LFCSP (CP-20-9) 30.4
Unit
°C/W
°C/W
°C/W
ESD CAUTION
Rev. D | Page 8 of 48