EVAL-ADM1275EBZ Datasheet, PDF (47/48 Pages) Analog Devices – Hot-Swap Controller and Digital Power

Data Sheet
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
5.10
5.00 SQ
4.90
TOP VIEW
0.35
0.28
0.65
BSC
0.23
16
15
20
1
EXPOSED
PAD
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
5
0.70
0.60
11
10
6
BOTTOM VIEW
0.25 MIN
0.40
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WHHC.
Figure 68. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-20-9)
Dimensions shown in millimeters
ADM1275
ORDERING GUIDE
Model¹
ADM1275-1ARQZ
ADM1275-1ARQZ-R7
ADM1275-1ACPZ
ADM1275-1ACPZ-R7
ADM1275-2ARQZ
ADM1275-2ARQZ-R7
ADM1275-3ARQZ
ADM1275-3ARQZ-R7
ADM1275-3ACPZ
ADM1275-3ACPZ-R7
EVAL-ADM1275EBZ
1 _{Z = RoHS Compliant Part.}
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
20-Lead QSOP
20-Lead QSOP
20-Lead LFCSP_WQ
20-Lead LFCSP_WQ
16-Lead QSOP
16-Lead QSOP
20-Lead QSOP
20-Lead QSOP
20-Lead LFCSP_WQ
20-Lead LFCSP_WQ
Evaluation Board
Package Option
RQ-20
RQ-20
CP-20-9
CP-20-9
RQ-16
RQ-16
RQ-20
RQ-20
CP-20-9
CP-20-9
Rev. D | Page 47 of 48