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ADP1853 Datasheet, PDF (6/28 Pages) Analog Devices – Synchronous, Step-Down DC-to-DC Controller
ADP1853
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, EN, RAMP
FB, COMP, SS, TRK, FREQ, SYNC, VCCO,
PGOOD, CLKOUT
ILIM, SW, CS to PGND
BST, DH to PGND
DL to PGND
BST to SW
BST to PGND to PGND 20 ns Transients
SW, CS to PGND 20 ns Transients
DL, SW, CS, ILIM to PGND 20 ns
Negative Transients
PGND to AGND
PGND to AGND 20 ns Transients
θJA (Natural Convection)1, 2
Operating Junction Temperature Range3
Storage Temperature Range
Maximum Soldering Lead Temperature
Rating
21 V
−0.3 V to +6 V
−0.3 V to +21 V
−0.3 V to +28 V
−0.3 V to VCCO + 0.3 V
−0.3 V to +6 V
32 V
25 V
−8 V
−0.3 V to +0.3 V
−8 V to +4 V
40°C/W
−40°C to +125°C
−65°C to +150°C
260°C
1 Measured with exposed pad attached to PCB.
2 Junction-to-ambient thermal resistance (θJA) of the package was calculated
or simulated on multilayer PCB.
3 The junction temperature (TJ) of the device is dependent on the ambient
temperature (TA) the power dissipation of the device (PD) and the junction to
ambient thermal resistance of the package (θJA). Maximum junction
temperature is calculated from the ambient temperature and power
dissipation using the formula TJ = TA + PD × θJA.
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
ESD CAUTION
Rev. 0 | Page 6 of 28