DS670 Datasheet, PDF (10/11 Pages) Xilinx, Inc – Low-power CMOS EPROM process

QPRO Family of XC1700E Configuration PROMs
Ordering Information
X-Ref Target - Figure 5
XC17256E DD8 M
Device Number
XC1765E
XC17256E
Package Type
DD8 = 8-pin Ceramic DIP
Operating Range/Processing
M = Military (T_C = –55° to +125°C)
B = Military (T_C = –55° to +125°C)
Figure 5: Ordering Information
ds670_05_120210
Valid Ordering Combinations
Table 10: Valid Ordering Combinations
XC17256EDD8M
XC1765EDD8M
XC17256EDD8B
XC1765EDD8B
Marking Information
Due to the small size of the PROM package, the complete ordering part number cannot be marked on the package. The XC
prefix is deleted and the package code is simplified. Devices are marked as shown in Figure 6.
X-Ref Target - Figure 6
17256E D M
Device Number
XC1765E
XC17256E
Package Type
D = 8-pin Ceramic DIP
Operating Range/Processing
M = Military (T_C = –55° to +125°C)
B = Military (T_C = –55° to +125°C)
Figure 6: Marking Information
ds670_06_120310
Revision History
The following table shows the revision history for this document.
Date
12/03/10
Version
1.0
Initial Xilinx release.
Revisions
DS670 (v1.0) December 3, 2010
www.xilinx.com
Product Specification
10