W972GG6JB Datasheet, PDF (86/87 Pages) Winbond – 16M  8 BANKS  16 BIT DDR2 SDRAM

W972GG6JB
11. PACKAGE SPECIFICATION
Package Outline WBGA-84 (11x13 mm²)
E1
Pin A1 index
A // bbb C
Pin A1 index
E
A1
9 8 76 5 43 21
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
eE
The window-side
ccc _C
B
84xΦb
encapsulant
C
Solder ball diameter refers.
To Post reflow condition.
Seating plane
ddd M C A B
eee M C
Dimension (mm)
Symbol
Min. Nom. Max.
A
---
--- 1.20
A1 0.25 --- 0.40
b
0.40 0.45 0.50
D 12.90 13.00 13.10
E 10.90 11.00 11.10
D1
11.20 BSC.
E1
6.40 BSC.
eE
0.80 BSC.
eD
0.80 BSC.
aaa
---
--- 0.15
bbb
---
--- 0.20
ccc
---
--- 0.10
ddd ---
--- 0.15
eee ---
--- 0.08
Ball Land
Ball Opening
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
aaa
A
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Publication Release Date: Nov. 29, 2011
Revision A02