W972GG6JB Datasheet, PDF (37/87 Pages) Winbond – 16M  8 BANKS  16 BIT DDR2 SDRAM

W972GG6JB
9. ELECTRICAL CHARACTERISTICS
9.1 Absolute Maximum Ratings
PARAMETER
SYMBOL
RATING
UNIT NOTES
Voltage on VDD pin relative to VSS
Voltage on VDDQ pin relative to VSS
Voltage on VDDL pin relative to VSS
Voltage on any pin relative to VSS
Storage Temperature
VDD
VDDQ
VDDL
VIN, VOUT
TSTG
-1.0 ~ 2.3
-0.5 ~ 2.3
-0.5 ~ 2.3
-0.5 ~ 2.3
-55 ~ 150
V
1, 2
V
1, 2
V
1, 2
V
1, 2
°C
1, 2, 3
Notes:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
2. When VDD and VDDQ and VDDL are less than 500mV; VREF may be equal to or less than 300mV.
3. Storage temperature is the case surface temperature on the center/top side of the DRAM.
9.2 Operating Temperature Condition
PARAMETER
SYMBOL MIN. MAX. UNIT
NOTES
Operating Temperature (for -18/-25/-3)
TCASE
0
85
°C
1, 3, 5
Operating Temperature (for 25I/25A/-3A)
TCASE
-40
95
°C
1, 3, 4, 5, 6, 7
Operating Temperature (for 25A/-3A)
TA
-40
95
°C
2
Operating Temperature (for 25K)
TCASE
-40
105
°C
1, 3, 4, 5, 6, 8
Operating Temperature (for 25K)
TA
-40
105
°C
2
Notes:
1. Operating case temperature is the case surface temperature on the center/top side of the DRAM.
2. Operating ambient temperature is the surrounding temperature of the DRAM.
3. Supporting 0°C ≤ TCASE ≤ 85°C with full JEDEC AC and DC specifications.
4. Supporting -40°C ≤ TCASE ≤ 85°C with full JEDEC AC and DC specifications.
5. Supporting 0°C ≤ TCASE ≤ 85°C and being able to extend to 95°C with doubling Auto Refresh commands in frequency to a
32 mS period ( tREFI = 3.9 µS) and to enter to Self Refresh mode at this high temperature range via A7 "1" on EMR (2).
6. Supporting -40°C ≤ TCASE ≤ 85°C and being able to extend to 95°C (for 25I/25A/-3A) or 105°C (for 25K) with doubling Auto
Refresh commands in frequency to a 32 mS period ( tREFI = 3.9 µS) and to enter to Self Refresh mode at this high
temperature range via A7 "1" on EMR (2).
7. During operation, the DRAM case temperature must be maintained between -40 to 95°C for 25I/25A/-3A parts under all
specification parameters.
8. During operation, the DRAM case temperature must be maintained between -40 to 105°C for 25K parts under all
specification parameters.
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Publication Release Date: Nov. 29, 2011
Revision A02