W25Q32JVTBIQ-TR Datasheet, PDF (6/76 Pages) Winbond – 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI

W25Q32JV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil
Top View
/CS
1
8
VCC
DO (IO₁)
IO2
2
7
3
6
IO3
CLK
GND
4
5
DI (IO₀)
Figure 1a. W25Q32JV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS / ST)
3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm
Figure 1b. W25Q32JV Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP, XG)
3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm, XSON 4x4-mm
PAD NO.
PAD NAME
I/O
FUNCTION
1
/CS
I
Chip Select Input
2
DO (IO1)
I/O
Data Output (Data Input Output 1)⁽¹⁾
3
IO2
I/O
Data Input Output 2⁽²⁾
4
GND
Ground
5
DI (IO0)
I/O
Data Input (Data Input Output 0)⁽¹⁾
6
CLK
I
Serial Clock Input
7
IO3
I/O
Data Input Output 3⁽²⁾
8
VCC
Power Supply
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions.
-5-