W25X16_08 Datasheet, PDF (49/50 Pages) Winbond – 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X16, W25X16A, W25X32, W25X64
16. REVISION HISTORY
VERSION
A
DATE
02/13/06
B
06/28/06
C
10/19/06
D
2/1/07
E
2/26/07
F
3/21/07
G
10/11/07
H
02/21/08
I
05/05/08
PAGE
1-4, 6, 32-36,
41 & 42
18, 35, 37 & 45
DESCRIPTION
New Create
Added W25X64 in the product family. Added
300mil PDIP package. Added 6x5 mm
WSON package. Updated Endurance and
Data Retention table (11.3), ICC’s in DC
Parameter table (11.5 & 11.6). Reduced tPP
(max) from 5mS to 3mS. Changed tSHCH
from 5nS to 0nS. Added byte programming
parameters (tBP1 & tBPn. Added additional
byte programming parameter, tBP2 and
moved multiple byte programming tBPn with
formula to foot note.
Changed tCHSH and tSHCH respectively
from 10nS and 0nS to 5nS and 5nS. Modified
the ordering information table to eliminate the
hyphen in the part number. Corrected Write
Enable/Disable text. Change ICC2 from 5uA
to 10uA.. Added footnotes in the ordering
information table. Updated ICC3 specs.
4 - 8 & 45
Updated package and ordering information.
6-9, 29, 33, 35,
38 & 45
34, 35, 41 & 46
All, 37, 38 & 44
1, 33, 37, 46 &
47
Updated Figure 2.
Updated ICC3 specs.
Added Valid Combinations for ordering info.
Added transient voltage specification.
Removed preliminary designation for 25X16.
Updated typical ratings on erase operations.
Updated table 12.3.
Updated ICC3 and ICC5 specs.
Added 300mil DIP package.
Added valid part number and marking table.
Added W25X16A.
Added WSON 8x6-MM drawing.
Updated Erase Time, tSHSL, tBP1.
Added W25X16A 150mil SOIC package.
Added W25X16AL (2.3V-3.6V).
Updated clock frequency.
Added note for WSON top side marking.
42
Update 8-pin PDIP package dimensions
- 49 -
Publication Release Date: may 5, 2008
Revision I