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W25X16_08 Datasheet, PDF (40/50 Pages) Winbond – 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X16, W25X16A, W25X32, W25X64
14. PACKAGE SPECIFICATION
14.1 8-Pin SOIC 150-mil (Package Code SN)
SYMBOL
A
A1
A2
b
C
D(3)
E
E1(3)
e(2)
L
θ
CP
MILLIMETERS
MIN
TYP.
MAX
1.47
1.60
1.72
0.10
---
0.24
---
1.45
---
0.33
0.41
0.50
0.19
0.20
0.25
4.80
4.85
4.95
5.80
6.00
6.19
3.80
3.90
4.00
1.27 BSC
0.40
0.71
1.27
0o
---
8o
---
---
0.10
INCHES
MIN
TYP.
MAX
0.058 0.063 0.068
0.004
---
0.009
---
0.057
---
0.013 0.016 0.020
0.0075 0.008 0.0098
0.189 0.191 0.195
0.228 0.236 0.244
0.150 0.154 0.157
0.050 BSC
0.015 0.028 0.050
0o
---
8o
---
---
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
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