W25X16_08 Datasheet, PDF (3/50 Pages) Winbond – 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X16, W25X16A, W25X32, W25X64
12.2.2 Instruction Set...............................................................................................................17
12.2.3 Write Enable (06h)........................................................................................................18
12.2.4 Write Disable (04h).......................................................................................................18
12.2.5 Read Status Register (05h) ..........................................................................................19
12.2.6 Write Status Register (01h) ..........................................................................................20
12.2.7 Read Data (03h) ...........................................................................................................21
12.2.8 Fast Read (0Bh) ...........................................................................................................22
12.2.9 Fast Read Dual Output (3Bh) .......................................................................................23
12.2.10 Page Program (02h) ...................................................................................................24
12.2.11 Sector Erase (20h) .....................................................................................................25
12.2.12 Block Erase (D8h) ......................................................................................................26
12.2.13 Chip Erase (C7h)........................................................................................................27
12.2.14 Power-down (B9h) ......................................................................................................28
12.2.15 Release Power-down / Device ID (ABh) .....................................................................29
12.2.16 Read Manufacturer / Device ID (90h) .........................................................................31
12.2.17 JEDEC ID (9Fh)..........................................................................................................32
13. ELECTRICAL CHARACTERISTICS......................................................................................... 33
13.1 Absolute Maximum Ratings .......................................................................................... 33
13.2 Operating Ranges......................................................................................................... 33
13.3 Endurance and Data Retention .................................................................................... 34
13.4 Power-up Timing and Write Inhibit Threshold .............................................................. 34
13.5 DC Electrical Characteristics ........................................................................................ 35
13.6 AC Measurement Conditions........................................................................................ 36
13.7 AC Electrical Characteristics ........................................................................................ 37
13.8 Serial Output Timing ..................................................................................................... 39
13.9 Input Timing .................................................................................................................. 39
13.10 Hold Timing ................................................................................................................. 39
14. PACKAGE SPECIFICATION .................................................................................................... 40
14.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 40
14.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 41
14.3 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 42
14.4 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 43
14.5 8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 45
14.6 16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 46
15. ORDERING INFORMATION .................................................................................................... 47
16. REVISION HISTORY ................................................................................................................ 49
Publication Release Date: may 5, 2008
-3-
Revision I