W25X16_08 Datasheet, PDF (44/50 Pages) Winbond – 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X16, W25X16A, W25X32, W25X64
8-Contact 6x5mm WSON Cont’d.
SYMBOL
MILLIMETERS
MIN
TYP.
MAX
SOLDER PATTERN
M
3.40
N
4.30
P
6.00
Q
0.50
R
0.75
INCHES
MIN
TYP. MAX
0.1338
0.1692
0.236 0
0.0196
0.0255
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid
placement of exposed PCB vias under the pad.
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