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W25X16_08 Datasheet, PDF (41/50 Pages) Winbond – 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X16, W25X16A, W25X32, W25X64
14.2 8-Pin SOIC 208-mil (Package Code SS)
SYMBOL
A
A1
A2
b
C
D
E
E1
e
L
θ
y
MILLIMETERS
MIN
MAX
1.75
2.16
0.05
0.25
1.70
1.91
0.35
0.48
0.19
0.25
5.18
5.38
7.70
8.10
5.18
5.38
1.27 BSC
0.50
0.80
0o
8o
---
0.10
INCHES
MIN
MAX
0.069 0.085
0.002
0.067
0.010
0.075
0.014 0.019
0.007 0.010
0.204 0.212
0.303
0.204
0.319
0.212
0.050 BSC
0.020 0.031
0o
8o
---
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
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Publication Release Date: may 5, 2008
Revision I