W9864G6JT Datasheet, PDF (41/42 Pages) Winbond – 1M  4 BANKS  16 BITS SDRAM

W9864G6JT
12. PACKAGE SPECIFICATION
12.1 TFBGA 54 Ball (8x8 mm², ball pitch:0.8mm, Ø =0.45mm)
987
A1 INDEX
3 21
A
B
C
D
E
F
G
H
J
Φb x54
SE
e
0.15 M C A B
0.08 M C
E1
A
A1
A1 INDEX
123
A
B
C
D
E
F
G
H
J
A
7 89
B
E
0.15 (4X)
SYMBOL
A
A1
b
D
D1
E
E1
SE
SD
e
DIMENSION (mm)
MIN.
---
NOM.
---
MAX.
1.20
0.28
---
0.40
0.40
0.45
0.50
7.90
8.00
8.10
6.40 BSC.
7.90
8.00
8.10
6.40 BSC.
1.60 TYP.
0.80 TYP.
0.80 BSC.
DIMENSION (inch)
MIN.
---
NOM.
---
MAX.
0.047
0.010
---
0.016
0.016 0.018 0.020
0.311 0.315 0.319
0.252 BSC.
0.311 0.315 0.319
0.252 BSC.
0.063 TYP.
0.031 TYP.
0.031 BSC.
Ball Land
Ball Opening
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
- 41 -
Publication Release Date: Dec. 23, 2011
Revision A01