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SI7501DN-T1-E3 Datasheet, PDF (2/15 Pages) Vishay Siliconix – Complementary 30-V (D-S) MOSFET
Si7501DN
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Static
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = - 250 µA
VDS = VGS, ID = 250 µA
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = ± 25 V
VDS = 0 V, VGS = ± 20 V
VDS = - 30 V, VGS = 0 V
Zero Gate Voltage Drain Current
IDSS
VDS = 30 V, VGS = 0 V
VDS = - 30 V, VGS = 0 V, TJ = 55 °C
VDS = 30 V, VGS = 0 V, TJ = 55 °C
On-State Drain Currenta
ID(on)
VDS ≥ - 5 V, VGS = - 10 V
VDS ≤ 5 V, VGS = 10 V
VGS = - 10 V, ID = - 6.4 A
Drain-Source On-State Resistancea
RDS(on)
VGS = 10 V, ID = 7.7 A
VGS = - 6 V, ID = - 5.3 A
VGS = 4.5 V, ID = 6.5 A
Forward Transconductancea
gfs
VDS = - 15 V, ID = - 6.4 A
VDS = 15 V, ID = 7.7 A
Diode Forward Voltagea
VSD
IS = - 1.7 A, VGS = 0 V
IS = 1.7 A, VGS = 0 V
Dynamicb
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Qg
P-Channel
VDS = - 15 V, VGS = - 10 V, ID = - 6.4 A
Qgs
N-Channel
Qgd
VDS = 15 V, VGS = 10 V, ID = 7.7 A
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
td(on)
tr
P-Channel
VDD = - 15 V, RL = 5 Ω
ID ≅ - 3 A, VGEN = - 10 V, RG = 1 Ω
Turn-Off Delay Time
Fall Time
td(off)
tf
N-Channel
VDD = 15 V, RL = 5 Ω
ID ≅ 3 A, VGEN = 10 V, RG = 1 Ω
Source-Drain Reverse Recovery Time
trr
IF = - 1.7 A, dI/dt = 100 A/µs
IF = 1.7 A, dI/dt = 100 A/µs
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
Min.
- 1.0
1.0
- 25
25
Typ. Max. Unit
-3
V
3
± 200
nA
± 100
-1
1
µA
-5
5
A
0.041 0.051
0.028 0.035
Ω
0.055 0.075
0.040 0.050
13
S
15
- 0.80 - 1.2
V
0.80
1.2
12.5
19
9
14
2.5
nC
2
3.6
1.3
9
Ω
3
10
15
10
15
20
30
15
25
25
40
20
30
ns
30
45
10
15
25
50
20
40
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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2
Document Number: 72173
S-81544-Rev. D, 07-Jul-08