SI7501DN-T1-E3 Datasheet, PDF (1/15 Pages) Vishay Siliconix – Complementary 30-V (D-S) MOSFET

Complementary 30-V (D-S) MOSFET
Si7501DN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
P-Channel
- 30
0.051 at V_GS = - 10 V
0.075 at V_GS = - 6 V
N-Channel
30
0.035 at V_GS = 10 V
0.050 at V_GS = 4.5 V
I_D (A)
- 6.4
- 5.3
7.7
6.5
PowerPAK 1212-8
3.30 mm
D
8
D
7
D
6
D
5
S1
1
G1
3.30 mm
2
S2
3
G2
4
Bottom View
Ordering Information: Si7501DN-T1-E3 (Lead (Pb)-free)
Si7501DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free Option Available
• TrenchFET^® Power MOSFET
• New Low Thermal Resistance
• PowerPAK^® Package with Low 1.07 mm
Profile
RoHS
COMPLIANT
APPLICATIONS
• Backlight Inverter
• DC/DC Converter
S₁
- 4 Cell Battery
G₁
D
G₂
S₂
P-Channel
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
P-Channel
N-Channel
Parameter
Symbol
10 s
Steady State
10 s
Steady State Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 30
V_GS
± 25
30
V
± 20
Continuous Drain Current (T_J = 150 °C)^a
Pulsed Drain Current
T_A = 25 °C
T_A = 70 °C
I_D
I_DM
- 6.4
- 4.5
- 5.1
- 3.6
- 25
7.7
5.4
4.7
4.3
A
25
Continuous Source Current (Diode Conduction)^a
I_S
- 2.6
- 1.3
2.6
1.3
Maximum Power Dissipation^a
T_A = 25 °C
T_A = 70 °C
P_D
3.1
3
1.6
1.0
3.1
2
1.6
W
1.0
Operating Junction and Storage Temperature Range
T_J, T_stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)^{b, c}
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^a
t ≤ 10 s
Steady State
R_thJA
32
65
40
81
°C/W
Maximum Junction-to-Foot (Case)
Steady State
R_thJC
5
6.3
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 72173
S-81544-Rev. D, 07-Jul-08
www.vishay.com
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