MSP430FR2111 Datasheet, PDF (58/75 Pages) Texas Instruments – Mixed-Signal Microcontrollers

MSP430FR2111, MSP430FR2110
SLASE78A – AUGUST 2016 – REVISED AUGUST 2016
7 Applications, Implementation, and Layout
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NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI's customers are
responsible for determining suitability fo components for their purposes. Customers should
validate and test their implementation to confirm system functionality.
7.1 Device Connection and Layout Fundamentals
This section describes the recommended guidelines when designing with the MSP430. These guidelines
are to make sure that the device has proper connections for powering, programming, debugging, and
optimum analog performance.
7.1.1 Power Supply Decoupling and Bulk Capacitors
TI recommends connecting a combination of a 10-µF capacitor and a 100-nF low-ESR ceramic decoupling
capacitor to the DVCC pin. Higher-value capacitors may be used but can impact supply rail ramp-up time.
Decoupling capacitors must be placed as close as possible to the pins that they decouple (within a few
millimeters).
Digital
Power Supply
Decoupling
+
1 µF
100 nF
DVCC
DVSS
Figure 7-1. Power Supply Decoupling
7.1.2 External Oscillator
Depending on the device variant (see Table 3-1), the device supports only a low-frequency crystal
(32 kHz) on the LFXT pins. External bypass capacitors for the crystal oscillator pins are required.
It is also possible to apply digital clock signals to the LFXIN input pins that meet the specifications of the
respective oscillator if the appropriate LFXTBYPASS mode is selected. In this case, the associated
LFXOUT pins can be used for other purposes. If the LFXOUT pins are left unused, they must be
terminated according to Section 4.5.
Figure 7-2 shows a typical connection diagram. See MSP430 32-kHz Crystal Oscillators for information on
selecting, testing, and designing a crystal oscillator with the MSP430 devices.
XIN
XOUT
C
C
L1
L2
Figure 7-2. Typical Crystal Connection
58
Applications, Implementation, and Layout
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